Quantitatively measure stress within the chips
Determine/Estimate the architecture of the active antenna array technology used in the product.
Determine if the Power Amplifier Module (PAM) uses Doherty combiner architecture and simulate its performance under dynamic loads
Determine if a certain type of circuit blocks is present in the product.
Analyze the interface between the copper layers and the insulator layers in the package PCB.
Determine if the products use certain optional features of the H.264 video codec standard.
Confirm the smartphone include an organic DASH client
Review the system design documents and source code to determine what part of the contractual deliverables and system performance were incomplete.
Show evidence of use of an essential patent claim regarding optional features of 802.11n/ac in the target devices