Certain stacked memory ICs available.
Qualitatively show the flexibility of the chips
- A mult-die stacked chip was identified, decapsulated and wire bonds removed.
- The dies were separated using a combination of aggressive solvents.
- One of the die was chosen for flexural analysis, with an edge fixed to a rigid surface and a displacement induced in the other edge using a micro-dynamometer.
- The dies were successfully shown to be very flexible after reviewing the details of the Stacked Chip Flexibility Testing.
More Case Studies
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