Stacked Chip Flexibility Testing Case Study Project

Stacked Chip Flexibility Testing
Case Study

Target Products

Certain stacked memory ICs available.

Purpose

Qualitatively show the flexibility of the chips

Procedure

- A mult-die stacked chip was identified, decapsulated and wire bonds removed.
- The dies were separated using a combination of aggressive solvents.
- One of the die was chosen for flexural analysis, with an edge fixed to a rigid surface and a displacement induced in the other edge using a micro-dynamometer.

Results of Stacked Chip Flexibility Testing

The dies were successfully shown to be very flexible after reviewing the details of the Stacked Chip Flexibility Testing.

More Case Studies

Interested in learning more about what we do here at GHB Intellect? Please feel free to browse the additional case studies listed below! If you still have additional questions or would like to speak to someone about your project, please give us a call at (858) 367-3642 or send us an email at info@ghbintellect.com.

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