Power Management Integrated Circuit (PMIC) design: DC/DC Converters Buck, Boost, Fly-Back, LDO, Charge pump, Bootstrap Capacitor Switching regulator to generate reverse polarity or higher and/or lower voltages. • Analog Circuits designs: Class A, AB, and C amplifiers, voltage follower (Common Collector, Common Drain), Common Gate or Common Base, Common Emitter or Common Source, Telescopic Cascode, Folded Cascode, current mirrors, high dynamic range low voltage cascode current mirrors, differential pairs, Op Amps, PTAT, Band Gap, comparators with hysteresis, LDO, and Feedback systems. • RF Mixers (Gilbert Cells), LNA, VCO, RSSI, high speed logic (ECL & SCL) for prescaler , and oscillator designs. • Monolithic Microwave Integrated Circuit (MMIC) circuit design in BiCMOS & CMOS using Si, SiGe, and GaAs Technology. • Phase Locked Loop (PLL) circuits (Phase Frequency Detector (PFD), PLL Loop Filter, Charge Pump, VCO, Prescaler, and divide by N) and PLL system design (P, P+1) • Chip System level ESD protection to meet HBM, CDM, and MM standards, ESD device protection circuit for input, outputs, drivers, and RF circuits. • Probing de-capped and de-pacified ICs to debug chip’s circuits

Most projects support a wide variety of IP customer needs ranging from transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital) chips to system-level testing, for example, firmware disassembly & analysis and signal tracing & analysis. Example projects: o Selected circuit extractions from commodity and embedded DRAMs o Analog circuit extraction & analysis of a Megapixel CMOS imager o Various firmware extractions from “secure” MPUs o A hardware-level security audit of a stored-value card

Lead and developed several memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM • Strong materials background with keen interest in corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing

• Non-Volatile memory, MRAM, Flash, T-RAM, Image sensors, LCD Displays • IC fabrication technology analysis • CMOS Logic, Analog BiCMOS • Photolithography, layer deposition, etching, trench isolation, gate dielectric, polysilicon gates. • Cu interconnects, Low K dielectrics, • Nanotechnology in physical sciences • Audit IC & MEMS fabrication facilities, processes, & reliability

LCDs, OLEDs, Smart TVs, III-V, Semiconductor, Streaming devices, Touch Screens, MEMs packaging, High Frequency RF, Telecom packaging, TFTs, LEDs, High frequency microwave devices, Lasers, Solar panels processing & packaging, Patent analysis, Prototyping products, TV and Media electronic guides