Expert ID
Core Expertise
Antenna, Power Amplifier design, RF circuit design, mobile base stations physical layer
Previous Companies
Nokia, Powerwave
Expert ID
Core Expertise
• Research and development of UWB, UMTS (WCDMA, HSDPA), and GSM systems. • Expertise in low power systems design for high speed modems and multi-media applications • Development of advanced UWB and UMTS transceivers, low power consumption architecture, and cross layer algorithm design
Previous Companies
• Broadcom • Qualcomm
Expert ID
Core Expertise
• ASIC/FPGA Design, implementation & verification • Embedded & DSP software development • Telecommunication systems & cellular modern development • 3GPP UMTS & LTE standard
Previous Companies
• Samsung • Nulife Technology • Ellipsis
Expert ID
Core Expertise
• Processors/CPUs, PCB, Fab processes • Ultra Fast Mixed-Signal Circuit, Space-based Communications, advanced submicron devices • Extensive experience with wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth • Hands on CMOS: architecture, design, tape-out and test complex chips, including memory, mixed signal, and RF • Extensive chip reverse engineering experience • Extensive circuit extraction experience • Patent and IP / IPR experience
Previous Companies
• Intel • Altera
Expert ID
Core Expertise
RF System design including high level architecture and behavioral modeling, Detailed system lineup and high level link budget, External component specifications and embedding, RF circuits design with simulation modeling, as well as hands on lab validation and optimization, RF/Mixed Signal block and modem partitioning
Previous Companies
NXP, Rockwell Semi, Ericsson, Radio System
Expert ID
Core Expertise
• Automotive Systems • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, object-oriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic.
Previous Companies
Freescale, Intersil, Conexant
Expert ID
Core Expertise
Patent infringement analysis•Patent review•Claim charts•Hardware & software reverse engineering•Telecommunications standards•Optical components•Optical systems & networks•RF & analog circuits•System on chip•Bluetooth, Wi-Fi & LTE•Claim language•People & project management
Previous Companies
Simplified Optics•Chipworks•Solantro
Expert ID
Core Expertise
• Semiconductor Process and Materials Research/Development • Encompassing Interconnect Conductive multi-level metallization, gate metallization, Inter-level dielectric Isolation and Passivation for fabrication of DRAM • Flash EEPROM • EPROM • Bipolar • Microprocessors • Semiconductor Microchip Packaging Materials and Process • Material’s Electrical, Mechanical, Chemical Characterization, and Product Reliability
Previous Companies
• Wilinx • Intel • Advanced Micro Devices (AMD) • United Technologies
Expert ID
Core Expertise
•Circuitdesign•FPGA design•DFT•Reconfigurable logic & tools
Previous Companies
•Element CXI•Droplet Technology•Morphics Technologies
Expert ID
Core Expertise
Microprocessors, Optical and magnetic storage, Technology licensing, ELC gate arrays
Previous Companies
Transmeta, Cirrus Logic, Sun Microsystems, Digital Equipment
Expert ID
Core Expertise
• Touch Screen, mobile touch business, smart display, semiconductor • Cellular baseband products, RF solutions and chipset and front end module products • Product and Program management • Global ecosystems • Human machine interface • IoT • Product evangelizing • Market Analysis & Penetration
Previous Companies
• Atmel • Synaptics
Expert ID
Core Expertise
•Operational systems (ERP...)•Quality systems (ISO 9001)•Photo (resist apply, image, bake, develop) –including lift-off•Wet Etching / Dry Etching (RIE, plasma)•Metal deposition (sputtering, organometallic, PECVD, etc)•Plating (electroless, electrolytic)•CNC, EDM, laser ablation / milling•Stamping, extruding, coining•Injection molding (plastic and metal), transfer molding (plastics)•Sintering, soldering, brazing, diffusion bonding•Expert in ICpackaging•Surface Mount Technology•Antenna design and development•Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
Previous Companies
•Intel•Sprint•Wireless Facilities Inc.
Expert ID
Core Expertise
Data converters, Mixed and analog signals
Previous Companies
ST, Motorola, Bell Labs
Expert ID
Core Expertise
FinFET, Low power Hardware/Software designs, IC & Systems design, Computer security, Quantum computing
Previous Companies
University of Michigan, Princeton University
Expert ID
Core Expertise
Computer power solutions•Power converter design•Analog/digital circuit design•Simulation and modeling•LED lighting•Power ICs
Previous Companies
Cree•Intersil Corporation•International Rectifier Corp
Expert ID
Core Expertise
•Expert in LCDs, TFTs, LEDs, OLEDs, LDs, CMOS IC/transistor device structure, and lasers.•Experienced in consumer electronics, semiconductor, automotive products, photonics, and display technologies.•Distinguished Inventor•Experienced patent analyst
Previous Companies
•Sony•IBM•Rambus•A prominent LED lighting manufacturer
Expert ID
Core Expertise
• Fiber Optic Telecommunication Networks • FTTH/PON/HFC • CWDM/DWDM • BC/NC Video Overlay • Ethernet Over Fiber • TV Transmission over Fiber • RF/Microwave/Millimeter-Wave
Previous Companies
• Huawei/Futurewei • Motorola
Expert ID
Core Expertise
Power Management Integrated Circuit (PMIC) design: DC/DC Converters Buck, Boost, Fly-Back, LDO, Charge pump, Bootstrap Capacitor Switching regulator to generate reverse polarity or higher and/or lower voltages. • Analog Circuits designs: Class A, AB, and C amplifiers, voltage follower (Common Collector, Common Drain), Common Gate or Common Base, Common Emitter or Common Source, Telescopic Cascode, Folded Cascode, current mirrors, high dynamic range low voltage cascode current mirrors, differential pairs, Op Amps, PTAT, Band Gap, comparators with hysteresis, LDO, and Feedback systems. • RF Mixers (Gilbert Cells), LNA, VCO, RSSI, high speed logic (ECL & SCL) for prescaler , and oscillator designs. • Monolithic Microwave Integrated Circuit (MMIC) circuit design in BiCMOS & CMOS using Si, SiGe, and GaAs Technology. • Phase Locked Loop (PLL) circuits (Phase Frequency Detector (PFD), PLL Loop Filter, Charge Pump, VCO, Prescaler, and divide by N) and PLL system design (P, P+1) • Chip System level ESD protection to meet HBM, CDM, and MM standards, ESD device protection circuit for input, outputs, drivers, and RF circuits. • Probing de-capped and de-pacified ICs to debug chip’s circuits
Previous Companies
Qualcomm • Agere Systems, Inc. • Cadence Design Systems, Inc.
Expert ID
Core Expertise
Strong background in all phases of: o Flash Memories o Flash Digital Forensic o Serial ATA o Cryptography (circuit level design) o Cyber Security o 802.11ab/g (wireless LAN) o 802.3ae(10G Ethernet) o Computing and Networking standards.
Previous Companies
Intel • Philips Semiconductor
Expert ID
Core Expertise
Most projects support a wide variety of IP customer needs ranging from transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital) chips to system-level testing, for example, firmware disassembly & analysis and signal tracing & analysis. Example projects: o Selected circuit extractions from commodity and embedded DRAMs o Analog circuit extraction & analysis of a Megapixel CMOS imager o Various firmware extractions from “secure” MPUs o A hardware-level security audit of a stored-value card
Previous Companies
Texas Instruments • Chipworks • Alliacense
Expert ID
Core Expertise
Lead and developed several memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM • Strong materials background with keen interest in corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing
Previous Companies
Micron • Moen • Xilinx
Expert ID
Core Expertise
DRAM/Flash IC design/test/technology/manufacturing • IC/CAD application/test development • Pre- and post-silicon product/project management • IT cloud technology • Cloud servers and storage in commercial and custom applications.
Previous Companies
ITT Technical Institute • Netlist • Ramaxel Technologies
Expert ID
Core Expertise
• Non-Volatile memory, MRAM, Flash, T-RAM, Image sensors, LCD Displays • IC fabrication technology analysis • CMOS Logic, Analog BiCMOS • Photolithography, layer deposition, etching, trench isolation, gate dielectric, polysilicon gates. • Cu interconnects, Low K dielectrics, • Nanotechnology in physical sciences • Audit IC & MEMS fabrication facilities, processes, & reliability
Previous Companies
• Texas Instrument • Philips
Expert ID
Core Expertise
• LED light design (optics design for street lighting, power supply electronics, luminaire fixtures thermal management design, driver electronics reliability prediction analysis.) • Thin film surface finish performance and evaluations – failure root cause analysis • Thin film coating technology • Printed Circuit Design • Li-ion battery design • Molecular and atomic analysis
Previous Companies
• LED Roadway Lighting • TE Connectivity • Hughes Research Laboratory
Expert ID
Core Expertise
LCDs, OLEDs, Smart TVs, III-V, Semiconductor, Streaming devices, Touch Screens, MEMs packaging, High Frequency RF, Telecom packaging, TFTs, LEDs, High frequency microwave devices, Lasers, Solar panels processing & packaging, Patent analysis, Prototyping products, TV and Media electronic guides
Previous Companies
• Tivo • Qualcomm • Microdisplay • IBM • Bell Labrotatories
Expert ID
Core Expertise
Hardware-based AI technologies • Semiconductor device architectures • FinFET • Nanosheet devices • SOI technology
Previous Companies
IBM