Semiconductors

Wireless Communication Systems, embedded processors and DSP, CDMA, WCDMA, OFDM, UMTS/LTE standards, Wi-Fi/IEEE802.11,IEEE802.15, Bluetooth, UWB, reconfigurable hardware architecture
PhD, VP Engineering, 24 years of hands-on experience, extensive experience in cellular network deployment and mobile phone designs, 1 book, numerous publications, 30+ patents, University of California lecturer
Nokia, AT&T, Olympus
Antenna, Power Amplifier design, RF circuit design, mobile base stations physical layer
University Professor, 16+ patents, 9 invited presentations, 51 journal/conference papers, 2 book chapters
Nokia, Powerwave

Over 35 years of hands-on experience in radio frequency engineering.Expertise in: High power amplifiers, transceiver and antenna design, communication and radar subsystem design.
View Fullscreen

mobile modem architecture, power management & optimization, Dynamic Voltage & Current Scaling, WCDMA, LTE, UWB
PhD, 12+ yrs of experience, 10+ patents, 10+ journal/conference papers, multitudes of awards
Qualcomm, Broadcom, Xerox
Mobile Systems 3G & 4G, ASIC & FPGA Design
PhD, 15 yrs of experience, 22 papers, 2 books, 35+ patents, University of California lecturer
Samsung, Siemens
Analog and RF circuit designs, Power management integrated circuit (PMIC), DC/DC Converters, LDO, amplifiers, LNA, RF mixers, PLL, ESD, charge pumps, rectifiers
PhD, 17 yrs of experience, 30+ commercial analog & PMIC designs, 11+ RFIC designs, 6+ discrete RF designs, multiple peer-reviewed papers
Qualcomm, Agere, Cadence
Flash memory, EPROM, Cryptography, ASIC, serial ATA, PCI, Cyber security, 802.11ab/g (wireless LAN), 802.3ae(10G Ethernet), Semiconductor failure analysis/Production/Manufacturing
MSEE, 20 yrs of experience, Forensic investigator, lecturer
Intel, AMD, Philips
wireless systems design, development, standards, mobile stations, base stations, 802.11xx, GSM, WCDMA, CDMA2000, LTE, LTE-Advanced, LTE-U, MIMO, Transmit diversity, MIMO, VoLTE
PhD, 23 yrs of hands-on experience, 70+ patent applications, numerous publications and book authorship
Qualcomm, Powerwave, Fujitsu, Motorola, Texas Instruments
Set-Top Box, MPEG-2, IEEE1394, Ethernet, DOCSIS, ARM, I2C, VHDL, HDLC, Video/Audio drivers, embedded Linux, Multi Thread RTOS environments, PCI
MSEE, 20+ yrs of experience, 6 patents
Vivato, Elintrix, Solekai Systems, Wind Rivers System, Rainbow Networks, Conexant Systems, Comstream Corporation
Embedded DRAM Memory, Semiconductor, Patent infringment, Failure analysis, transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital)
BSEE, 35+ yrs of experience
Texas Instruments, Chipworks, Mosaid Technologies, Apollo Systems Research Corp, Taeus, Atmos, Nortel, STMicroelectronics, Omicron

Processors/CPUs, PCB, Fab processes; wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth; CMOS design, architecture, tape-out and test including memory, mixed signal, and RF; chip reverse engineering; circuit extraction; patent analysis
30+ mixed signal chips designed/fabricated; 70 technical publications; 100+ patents; Professional Engineer; Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute

Intel, Airfy Communications, Altera

PhD in EE; minor in Aeronautical Engineering; Space-based Communication; over 20 years of experience in the semiconductor manufacturing industry

Advanced IC packaging; Materials characterization; Memory packaging in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F; Strong materials background (corrosion, organic/inorganic hybrid coating, adhesion, solder metallurgy, electroplating)
MS in Material Science, 32 patents, 13 yrs of experience, CEF certification
Micron, Moen, Ralson
DRAM/Flash IC, IC/CAD, pre and post-silicon, IT cloud technology
PhD, 30+ Yrs of experience, Co-Awarded “The Innovator of the Year”, Instructor of Associate & Bachelor Degree Programs
Siemens, Netlist, Ramaxel Technologies, Qimonda/Infineon
RF design, RFIC, Analog circuits, Antennas, Set-top box design and development
• 15 patents in the RF Systems, Circuits and Communication Systems area
• AeA High Tech Innovation Awards
• EE Times ACE Awards
• Member of IEEE Solid State Circuits
NXP, Rockwell Semi, Ericsson

Passionate Senior Communication Systems Semiconductor Business Leader with 20 years of experience. Specializes in business center management, product line management, RF Systems, RFIC, Mixed signal and DSP R&D management. MSEE

• Automotive Systems • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, object-oriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic.
• 40 + patents
• IEEE 802 LAN/MAN Standards Committee
• Voting member, 1993-2002; Editor, State Machines, 1996-1999; Editor, Task Group E, 2000-2002
• JEDEC JC-61 Standards Committee, Member
• Designed 24 processors in technologies ranging from TTL MSI to 45nm CMOS.
Freescale, Intersil, Conexant

Over 30 years of experience in computer and system architecture, R&D, wired and wireless data networks, LTE, Wi-Fi protocols and IEEE 802.11 standards.
More than 25 patent litigation cases. Gave depositions and testified in court both in the U.S. and in Europe. Did numerous portfolio evaluations, claim analyses and prior art searches.
12 years developing raster graphics and image processing systems, I/O controllers and multiprocessor workstations. Invented and led development of the world’s first RAM-based color raster graphics system.
10 years applied symmetric multiprocessing to LAN servers and pioneered the use of a LAN as a virtual I/O channel. Invented and led development of the world’s first LAN with dynamically variable data rates.
15 years wireless data networks.
3 years writing operating systems and compilers

View Fullscreen
Optical networks, Optical trasnceivers, DWDM
MSEE, over 20 yrs experience in optical product development and related standards
Xtera, Solantro, Meriton Networks, AcceLight Networks, Nortel
Semiconductor fabs, metallurgical Eng., Memory, Micro processors
PhD, AMD fellow, 30 yrs of experience, 4 patents, 8 papers
AMD, Intel, SGS Thompson
Reconfigurable Dataflow µP, DFE IP, 12M-gate ASIC, FPGA (Xilinx, Altera), DFT
BS, 20+ years of experience,6 patents, co-authored 26 patents, 13 articles/conference papers
Element CXI, Droplet Technology, Morphics Technologies, HighGate Design
Microprocessors, Optical and magnetic storage, Technology licensing, ELC gate arrays
BSEE, 25+ years of experience, 3 patents, Board and finance committee of an educational non-profit, CEO of a mobile security devices supplier company, President of a non-profit technology
Transmeta, Cirrus Logic, Sun Microsystems, Digital Equipment
Touch Screen, mobile touch business, smart display, semiconductor, Cellular baseband products, RF solutions and chipset and front end module products, Product and Program management, Global ecosystems, Human machine interface, IoT, Product evangelizing, Market Analysis & Penetration
MSEE, 18+ Yrs of experience, , 3 Published Patents3 Published Patents
Atmel, Synaptics, A Semiconductor company, A wireless, semiconductor company
DSL Satellite, Semiconductor, Video Compression, Video Streaming, VoIP, Embedded Software, Internet Software
Ph.D, 20+ Yrs of experience, 2 Patents, 8 Publication
Maxim Integrated Products, Texas Instrument, 8*8, Hughes Aircraft
Fab process & materials (wafer, PCB, assembly, components, IC packaging): Photo, Etching (Wet, Dry), Metal deposition, Plating, CNC, EDM, laser ablation/milling, Stamping, extruding, coining, Injection molding, transfer molding, Sintering, soldering, brazing, diffusion bonding, Surface mount technology; Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
MS, 30+ yrs of experience, 38 patents, 24 papers
Ethertronics, IBM, Amkor, CoolClouds
Data converters, Mixed and analog signals
MSEE, 30+ yrs of experience
ST, Motorola, Bell Labs
FinFET, Low power Hardware/Software designs, IC & Systems design, Computer security, Quantum computing
Professor, 35+ yrs experience, 49 research grants, 18 patents, 445 conference/lecture/papers/publication
University of Michigan, Princeton University
Power converter, Analog/Digital circuit, PFC boost, LED, IC
MS, 35+ years of experience, Created unique LED lighting, IEEE senior member, 60+ patents filed
GE – Aerospace Control Sys., Harris Semiconductor, Intersil, Cree, International Rectifier Corporation
RF DSP, STM32 microcontrollers, MEMS, DC-DC converters, Imaging sensors, MPEG audio/video decoders
MS, 25 years of experience, Received 5 STMicrolelctronics Exceptional Patent Awards, 16 US patents, Several papers published
STMicroelectronics
Consumer electronics, Semiconductor, Automotive products, Photonics, Display, LCDs, TFTs, LEDs, OLEDs, LDs, CMOS IC/transistor device structure, and lasers
25+ yrs of industry experience in lasers and displays as well as other consumer electronics.
Sony, IBM, Rambus, A prominent LED lighting manufacturer
Fiber Optic Telecommunication Networks, FTTH/PON/HFC, CWDM/DWDM, BC/NC Video Overlay, Ethernet Over Fiber, TV Transmission over Fiber, RF/Microwave/Millimeter-Wave
13 granted patents, Senior Member of IEEE
Huawei/Futurewei, Motorola, An aerospace, defense and security company, A research center for aircrafts
Non-Volatile memory, MRAM, Flash, T-RAM, Image sensors, LCD Displays, IC fabrication technology analysis, CMOS Logic, Analog BiCMOS, Photolithography, layer deposition, etching, trench isolation, gate dielectric, polysilicon gates, Cu interconnects, Low K dielectrics, Nanotechnology in physical sciences, Audit IC & MEMS fabrication facilities, processes, & reliability
 Received 2015 IEEE Region 6 Central Area Outstanding Engineer Award.
 Life Senior Member of the IEEE.
 10 issued/9 pending US patent applications & 6 Publications
 2015 IEEE Region 6 Central Area Outstanding Engineer Award
 Member of the Executive Steering Committee of the San Francisco Bay Area Nanotechnology Council Chapter, 2005 to present. 2009 & 2014 Chair.
 IEEE SFBA Nanotechnology Council Chapter wins 2014 IEEE NTC Chapter Award.
 Editorial Board Member – International Journal of Humanitarian Technology
 IEEE Global Humanitarian Technology Conference – 2014 Health Track Program Co-Chair
 Listed as a Grant Reviewer for the NSF
• Texas Instrument • Philips

Expert in Image Sensor fabrication, operation, devices, packaging
Extensive industry experience spanning multiple applications of Integrated Circuit Technology with an emphasis in fabrication technology
Has contributed in Defense and Aerospace, Semiconductor Device and Manufacturing process development, 3G mobile technology, and Disk Drive Technology

• LED light design (optics design for street lighting, power supply electronics, luminaire fixtures thermal management design, driver electronics reliability prediction analysis.) • Thin film surface finish performance and evaluations – failure root cause analysis • Thin film coating technology • Printed Circuit Design • Li-ion battery design • Molecular and atomic analysis
• 54 Publications
• 22 Patents
• Harvard University: Associate Research Scientist
• University of Pennsylvania: Professor in Material Science and Engineering
• Technical Reviewer: Thin Solid Films and other journals
• Invited Lecturer:
Technology Workshops and Presentations at: Cisco, Celestica, Flextronics, Solectron,Jabil, Northrop Grummund, Motorola, Nokia, Raytheon, Boeing; and many other companies.
• LED Roadway Lighting • TE Connectivity • Hughes Research Laboratory

35+ yrs of experience in electronic materials, micro-devices, system design, failure analysis, surface science, thin films for both optical and electronic applications for LED device design, light fixture design and optimization, PCB, advanced electronics for LED power supply drivers and controllers, semiconductor devices, Li-Ion battery development for space satellites.
Experienced in depositions, expert declarations.

LCDs, OLEDs, Smart TVs, III-V, Semiconductor, Streaming devices, Touch Screens, MEMs packaging, High Frequency RF, Telecom packaging, TFTs, LEDs, High frequency microwave devices, Lasers, Solar panels processing & packaging, Patent analysis, Prototyping products, TV and Media electronic guides
• 20+ publications in technical journals and conference proceedings, example search:
• 31 US Issued Patents; 1 pending
• Languages: English and French
• Tivo • Qualcomm • Microdisplay • IBM • Bell Labrotatories

• PhD, 35+ years combined experience in High Technology; Manufacturing, Development, Research and Start Up Companies
• Manufacturing, Outsourcing, Product Qualification, Reliability and Equipment Design of High-Tech Electronics
• Specialized Technical Skills: LCD, OLED, Electronic Packaging of Displays and Components, Touchscreens, Smartphone Teardown and Analysis
• Lecturer in Electronic Displays and Inter-Disciplinary Work in Biophysics Technologies
• Liquid Crystal Displays and Flat Panel Display Design/Packaging/Manufacturing
View Fullscreen