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RF

T112
Category:
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Core Expertise:
Antenna, Power Amplifier design, RF circuit design, mobile base stations physical layer
Accomplishments:
University Professor, 16+ patents, 9 invited presentations, 51 journal/conference papers, 2 book chapters
Previous Companies:
Nokia, Powerwave
Summary:

Over 35 years of hands-on experience in radio frequency engineering.Expertise in: High power amplifiers, transceiver and antenna design, communication and radar subsystem design.

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T232
Category:
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Core Expertise:
RF System design including high level architecture and behavioral modeling, Detailed system lineup and high level link budget, External component specifications and embedding, RF circuits design with simulation modeling, as well as hands on lab validation and optimization, RF/Mixed Signal block and modem partitioning
Accomplishments:
• AeA High Tech Innovation Awards
• EE Times ACE Awards
• Member of IEEE Solid State Circuits
Previous Companies:
NXP, Rockwell Semi, Ericsson, Radio System
Summary:

Passionate senior communication systems semiconductor business leader with extensive expertise. Specializes in business center management, RF systems, RFIC, mixed signal and DSP R&D management.

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T327
Category:
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Core Expertise:
• High performance analog mixed signal • RF IC design & layout • Discrete-component board level design and layout • System analysis
Accomplishments:
• IEEE Senior Member
• Two-time Hughes Aircraft Division Patent Award winner
• 59 issued US patents, over 200 issued international patents
• Numerous IC design team awards at Hughes and Raytheon
• Hughes Masters Fellow, Engineers Fellow, Doctoral Fellow
• Menara Networks EDC IC Team Award
Previous Companies:
• Menara Networks • Hughes Aircraft / Raytheon
Summary:

20+ yrs of experience especially in high performance / high dynamic range analog mixed signal, custom digital, and RF integrated circuit design
59 granted US patents
200+ international patents

T511
Category:
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Core Expertise:
LCDs, OLEDs, Smart TVs, III-V, Semiconductor, Streaming devices, Touch Screens, MEMs packaging, High Frequency RF, Telecom packaging, TFTs, LEDs, High frequency microwave devices, Lasers, Solar panels processing & packaging, Patent analysis, Prototyping products, TV and Media electronic guides
Accomplishments:
• 20+ publications in technical journals and conference proceedings, example search:
• 31 US Issued Patents; 1 pending
• Languages: English and French
Previous Companies:
• Tivo • Qualcomm • Microdisplay • IBM • Bell Labrotatories
Summary:

• PhD, 35+ years combined experience in High Technology; Manufacturing, Development, Research and Start Up Companies
• Manufacturing, Outsourcing, Product Qualification, Reliability and Equipment Design of High-Tech Electronics
• Specialized Technical Skills: LCD, OLED, Electronic Packaging of Displays and Components, Touchscreens, Smartphone Teardown and Analysis
• Lecturer in Electronic Displays and Inter-Disciplinary Work in Biophysics Technologies
• Liquid Crystal Displays and Flat Panel Display Design/Packaging/Manufacturing

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T514
Category:
,
Core Expertise:
• Antenna design and fabrications • RF design • Satellite communications • Analog Integrated circuit design, Photonics • Software: Ansoft HFSS, AWR Microwave office, Grasp, Matlab, MoM.
Accomplishments:
• 6 patents
• 2 plenary talks
• 8 journal papers
• 3 technical reports
• 21 conference papers
• Finalist in student paper contest IEEE APS 2006.
• Honored as outstanding graduate student
Previous Companies:
• SpaceX
Summary:

• 10+ years of experience in antenna design, simulation, fabrication, instruments (Network analyzer, Spectrum analyzer, Oscilloscope …), PCB etching,, near-field and far-field measurements
• PhD in Electrical Engineering
• 6 granted US patents

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