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Memory

T156
Category:
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Core Expertise:
• Processors/CPUs, PCB, Fab processes • Ultra Fast Mixed-Signal Circuit, Space-based Communications, advanced submicron devices • Extensive experience with wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth • Hands on CMOS: architecture, design, tape-out and test complex chips, including memory, mixed signal, and RF • Extensive chip reverse engineering experience • Extensive circuit extraction experience • Patent and IP / IPR experience
Accomplishments:
• 100+ patents
• 30+ mixed signal chips designed/fabricated
• 70 technical publications
• Professional Engineer (PE)
• Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute
Previous Companies:
• Intel • Altera
Summary:

Over 20 years of experience in the semiconductor manufacturing industry.
PhD in EE, minor in Aeronautical Engineering, Space-based Communications
Over a decade of experience at Intel

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T129
Category:
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Core Expertise:
• NAND and ReRAM performance optimization • NAND, SCM and SSD product strategy • NAND flash and SSD qualification testing • Agile Development (Scrum and Kanban) • Machine Learning Model Prototyping • Python, TensorFlow, SQL, Spark, AWS • KPI Dashboards and Data Analysis in Spotfire • User Experience and interaction Design • Usability Testing, Surveys, A/B Testing
Previous Companies:
• SanDisk • HGST
Summary:

PhD with 17+ years of industry experience

SanDisk/Western Digital
Hitachi Global Storage Technologies

Successfully created innovative products in large complex organizations, as well as in small startups with tight budgets.
41 granted patents

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T131
Category:
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Core Expertise:
Strong background in all phases of: o Flash Memories o Flash Digital Forensic o Serial ATA o Cryptography (circuit level design) o Cyber Security o 802.11ab/g (wireless LAN) o 802.3ae(10G Ethernet) o Computing and Networking standards.
Previous Companies:
Intel • Philips Semiconductor
Summary:

• Over 18 years of experience in leading edge technology in various engineering disciplines including
design/verification, production and manufacturing, research & development of high speed networking and
communication, quality assurance, integration and segmentation at top global leading semiconductor
companies in Silicon Valley.
• Extensive experience in preparing, and teaching general and highly customized technical courses for new
hired engineers and training overseas engineering staff.

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T152
Category:
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Core Expertise:
Most projects support a wide variety of IP customer needs ranging from transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital) chips to system-level testing, for example, firmware disassembly & analysis and signal tracing & analysis. Example projects: o Selected circuit extractions from commodity and embedded DRAMs o Analog circuit extraction & analysis of a Megapixel CMOS imager o Various firmware extractions from “secure” MPUs o A hardware-level security audit of a stored-value card
Previous Companies:
Texas Instruments • Chipworks • Alliacense
Summary:

• 35 years of engineering experience in semiconductor design, analysis, measurement, debug, failure analysis and patent infringement analysis. • Prior to freelancing, worked at the memory design firm Mosaid from 1980 to 1994 (64K to 16M DRAM generations) in various roles including designer, design manager, and engineering sales. David now reverseengineers RAM circuits for IP clients, his most recent analysis being a 90 nm embedded DRAM in a leading cellphone device.

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T187
Category:
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Core Expertise:
Lead and developed several memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM • Strong materials background with keen interest in corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing
Previous Companies:
Micron • Moen • Xilinx
Summary:

• 12+ yrs. diverse experience in advanced IC packaging development, process integration, materials characterization and program management • Authored 32 (issued/pending) patents and 16 technical publications • Certified Electroplater Finisher (CEF) by American Electroplaters and Surface Finishers Society • Knowledge of various characterization/FA techniques & problem solving methodologies 8D, DOE, SPC, FMEA, KT • Well versed in computer applications, highly motivated team leader with strong presentation and interpersonal skills

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T228
Category:
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Core Expertise:
DRAM/Flash IC design/test/technology/manufacturing • IC/CAD application/test development • Pre- and post-silicon product/project management • IT cloud technology • Cloud servers and storage in commercial and custom applications.
Previous Companies:
ITT Technical Institute • Netlist • Ramaxel Technologies
Summary:

• 30+ years of national and international management, business development, marketing, and engineering.

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T453
Category:
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Core Expertise:
• Non-Volatile memory, MRAM, Flash, T-RAM, Image sensors, LCD Displays • IC fabrication technology analysis • CMOS Logic, Analog BiCMOS • Photolithography, layer deposition, etching, trench isolation, gate dielectric, polysilicon gates. • Cu interconnects, Low K dielectrics, • Nanotechnology in physical sciences • Audit IC & MEMS fabrication facilities, processes, & reliability
Accomplishments:
• Received 2015 IEEE Region 6 Central Area Outstanding Engineer Award.
• Life Senior Member of the IEEE.
• 10 issued/9 pending US patent applications & 6 Publications
• 2015 IEEE Region 6 Central Area Outstanding Engineer Award
• Member of the Executive Steering Committee of the San Francisco Bay Area Nanotechnology Council Chapter, 2005 to present. 2009 & 2014 Chair.
• IEEE SFBA Nanotechnology Council Chapter wins 2014 IEEE NTC Chapter Award.
• Editorial Board Member – International Journal of Humanitarian Technology
• IEEE Global Humanitarian Technology Conference – 2014 Health Track Program Co-Chair
• Listed as a Grant Reviewer for the NSF
Previous Companies:
• Texas Instrument • Philips
Summary:

Expert in Image Sensor fabrication, operation, devices, packaging
Extensive industry experience spanning multiple applications of Integrated Circuit Technology with an emphasis in fabrication technology
Has contributed in Defense and Aerospace, Semiconductor Device and Manufacturing process development, 3G mobile technology, and Disk Drive Technology

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T547
Category:
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Core Expertise:
• Automotive Systems, cellular network and protocols (GSM, LTE, 5G) • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, objectoriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic. • System busses and I/O control protocols.
Previous Companies:
• SanDisk • Stanford • Friend Software Corp
Summary:

• More than 15 years of experience in embedded systems development (hardware, ASIC/SoC, cloud, and software) for power, performance, and cost-optimized devices
• 26 granted patents (power management, firmware, processing algorithms, bus control in SoC, SSD, and storage)
• 7 presentations, publications, and lectures

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