Memory

Expert ID:
Core Expertise:
• Processors/CPUs, PCB, Fab processes • Ultra Fast Mixed-Signal Circuit, Space-based Communications, advanced submicron devices • Extensive experience with wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth • Hands on CMOS: architecture, design, tape-out and test complex chips, including memory, mixed signal, and RF • Extensive chip reverse engineering experience • Extensive circuit extraction experience • Patent and IP / IPR experience
Previous Companies:
• Intel • Altera
Expert ID:
Core Expertise:
• NAND and ReRAM performance optimization • NAND, SCM and SSD product strategy • NAND flash and SSD qualification testing • Agile Development (Scrum and Kanban) • Machine Learning Model Prototyping • Python, TensorFlow, SQL, Spark, AWS • KPI Dashboards and Data Analysis in Spotfire • User Experience and interaction Design • Usability Testing, Surveys, A/B Testing
Previous Companies:
• SanDisk • HGST
Expert ID:
Core Expertise:
Strong background in all phases of: o Flash Memories o Flash Digital Forensic o Serial ATA o Cryptography (circuit level design) o Cyber Security o 802.11ab/g (wireless LAN) o 802.3ae(10G Ethernet) o Computing and Networking standards.
Previous Companies:
Intel • Philips Semiconductor
Expert ID:
Core Expertise:
Most projects support a wide variety of IP customer needs ranging from transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital) chips to system-level testing, for example, firmware disassembly & analysis and signal tracing & analysis. Example projects: o Selected circuit extractions from commodity and embedded DRAMs o Analog circuit extraction & analysis of a Megapixel CMOS imager o Various firmware extractions from “secure” MPUs o A hardware-level security audit of a stored-value card
Previous Companies:
Texas Instruments • Chipworks • Alliacense
Expert ID:
Core Expertise:
Lead and developed several memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM • Strong materials background with keen interest in corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing
Previous Companies:
Micron • Moen • Xilinx
Expert ID:
Core Expertise:
DRAM/Flash IC design/test/technology/manufacturing • IC/CAD application/test development • Pre- and post-silicon product/project management • IT cloud technology • Cloud servers and storage in commercial and custom applications.
Previous Companies:
ITT Technical Institute • Netlist • Ramaxel Technologies
Expert ID:
Core Expertise:
• Non-Volatile memory, MRAM, Flash, T-RAM, Image sensors, LCD Displays • IC fabrication technology analysis • CMOS Logic, Analog BiCMOS • Photolithography, layer deposition, etching, trench isolation, gate dielectric, polysilicon gates. • Cu interconnects, Low K dielectrics, • Nanotechnology in physical sciences • Audit IC & MEMS fabrication facilities, processes, & reliability
Previous Companies:
• Texas Instrument • Philips
Expert ID:
Core Expertise:
• Automotive Systems, cellular network and protocols (GSM, LTE, 5G) • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, objectoriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic. • System busses and I/O control protocols.
Previous Companies:
• SanDisk • Stanford • Friend Software Corp