Material Science

Core Expertise: • Specialty coatings, electroplating, anodizing development • Specialty elastomers, thermoplastics, textiles development • Thermal, EMI, EMC, battery application development • New material and process development, product introduction, supplier management
Previous Companies: Google, Apple, Microsoft, Amazon , Alcoa, Dow Corning, Mattel, Fisher- Price, GM, Nippondenso
Summary:

25+ years of experience in material and process development
Deep experiences with large industry players as well as start-ups
Experiences with Consumer electronics, electric vehicles, automotive electronics, medical devices, toys, notebooks/tablets, waterproof I/O
Failure analysis, new materials, new product introduction

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Core Expertise: corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing, memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM
Accomplishments: • 2020: 82 patent applications (58 issued) & 21 technical publications
• 2017: FPGA-HBM CPI work featured in 2 industry analyst blogs (1 & 2) on adv. packaging
• 2016: Top 20 Innovator Award from Idaho Genius
• 2009: IMAPS Best Paper of the Session award on ENEP wirebond & solderability
• 2006: Certified Electroplater Finisher (CEF) award by American Electroplater Society
• 2004: Outstanding Poster Presentation award by University of Cincinnati
Previous Companies: Micron, Moen, Xilinx
Summary:

12+ yrs. diverse experience in advanced IC packaging development, process integration, materials characterization and program management
Authored 32 (issued/pending) patents and 16 technical publications
Certified Electroplater Finisher (CEF) by American Electroplaters and Surface Finishers Society
Knowledge of various characterization/FA techniques & problem solving methodologies 8D, DOE, SPC, FMEA, KT
Well versed in computer applications, highly motivated team leader with strong presentation and interpersonal skills
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