Material Science
25+ years of experience in material and process development
Deep experiences with large industry players as well as start-ups
Experiences with Consumer electronics, electric vehicles, automotive electronics, medical devices, toys, notebooks/tablets, waterproof I/O
Failure analysis, new materials, new product introduction
• 2017: FPGA-HBM CPI work featured in 2 industry analyst blogs (1 & 2) on adv. packaging
• 2016: Top 20 Innovator Award from Idaho Genius
• 2009: IMAPS Best Paper of the Session award on ENEP wirebond & solderability
• 2006: Certified Electroplater Finisher (CEF) award by American Electroplater Society
• 2004: Outstanding Poster Presentation award by University of Cincinnati
12+ yrs. diverse experience in advanced IC packaging development, process integration, materials characterization and program management
Authored 32 (issued/pending) patents and 16 technical publications
Certified Electroplater Finisher (CEF) by American Electroplaters and Surface Finishers Society
Knowledge of various characterization/FA techniques & problem solving methodologies 8D, DOE, SPC, FMEA, KT
Well versed in computer applications, highly motivated team leader with strong presentation and interpersonal skills
• Experienced materials engineer
• Experienced patent technical advisor with proficiency in patentability analysis & patent drafting
• Extensive knowledge in patent law
• 25+ years of experience in the medical device, optics, packaging, military & consumer products industries
• Has held technical leadership positions in management, engineering, manufacturing & product development
• Decades of experience managing production transfers & cross functional teams