Circuits

Core Expertise:
Antenna, Power Amplifier design, RF circuit design, mobile base stations physical layer
Accomplishments:
University Professor, 16+ patents, 9 invited presentations, 51 journal/conference papers, 2 book chapters
Previous Companies:
Nokia, Powerwave
Summary:

Over 35 years of hands-on experience in radio frequency engineering.Expertise in: High power amplifiers, transceiver and antenna design, communication and radar subsystem design.

Core Expertise:
• Research and development of UWB, UMTS (WCDMA, HSDPA), and GSM systems. • Expertise in low power systems design for high speed modems and multi-media applications • Development of advanced UWB and UMTS transceivers, low power consumption architecture, and cross layer algorithm design
Accomplishments:
• 6 US Patents
• 6 Publications
Previous Companies:
• Broadcom • Qualcomm
Summary:

Nearly 20 years of experience in the wireless communication systems field in both start-up and large companies in research and development.

Core Expertise:
• ASIC/FPGA Design, implementation & verification • Embedded & DSP software development • Telecommunication systems & cellular modern development • 3GPP UMTS & LTE standard
Accomplishments:
• 8 US patents and 35+ European and International patents awarded
• 20 technical papers and publications
• 2 books published
• Adjunct Professor and Lecturer of courses in 2G, 3G, and 4G Telecommunication Systems (LTE)
• Review Panel Member for the National Science Foundation (NSF)
Previous Companies:
• Samsung • Nulife Technology • Ellipsis
Summary:

• Telecommunications & DSP SoC architect, ASIC designer, & embedded software designer
• 20+ years of technology experience
• 15+ years of industry experience designing & managing telecommunications, electronic design automation & image processing products & projects

Core Expertise:
• Processors/CPUs, PCB, Fab processes • Ultra Fast Mixed-Signal Circuit, Space-based Communications, advanced submicron devices • Extensive experience with wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth • Hands on CMOS: architecture, design, tape-out and test complex chips, including memory, mixed signal, and RF • Extensive chip reverse engineering experience • Extensive circuit extraction experience • Patent and IP / IPR experience
Accomplishments:
• 100+ patents
• 30+ mixed signal chips designed/fabricated
• 70 technical publications
• Professional Engineer (PE)
• Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute
Previous Companies:
• Intel • Altera
Summary:

Over 20 years of experience in the semiconductor manufacturing industry.
PhD in EE, minor in Aeronautical Engineering, Space-based Communications
Over a decade of experience at Intel

Core Expertise:
Bio-sciences, Drug Design/Discovery, small molecule research
Accomplishments:
Post-Doc Bio-Chemistry, 23 yrs of experience, Chief scientific officer
Previous Companies:
Amgen, Epigen Combichem, DuPont, Optimer
Core Expertise:
RF System design including high level architecture and behavioral modeling, Detailed system lineup and high level link budget, External component specifications and embedding, RF circuits design with simulation modeling, as well as hands on lab validation and optimization, RF/Mixed Signal block and modem partitioning
Accomplishments:
• AeA High Tech Innovation Awards
• EE Times ACE Awards
• Member of IEEE Solid State Circuits
Previous Companies:
NXP, Rockwell Semi, Ericsson, Radio System
Summary:

Passionate senior communication systems semiconductor business leader with extensive expertise. Specializes in business center management, RF systems, RFIC, mixed signal and DSP R&D management.

Core Expertise:
• Automotive Systems • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, object-oriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic.
Accomplishments:
• 40 + patents
• IEEE 802 LAN/MAN Standards Committee
• Voting member, 1993-2002; Editor, State Machines, 1996-1999; Editor, Task Group E, 2000-2002
• JEDEC JC-61 Standards Committee, Member
• Designed 24 processors in technologies ranging from TTL MSI to 45nm CMOS.
Previous Companies:
Freescale, Intersil, Conexant
Summary:

Over 30 years of experience in computer and system architecture, R&D, wired and wireless data networks, LTE, Wi-Fi protocols and IEEE 802.11 standards.
More than 25 patent litigation cases. Gave depositions and testified in court both in the U.S. and in Europe. Did numerous portfolio evaluations, claim analyses and prior art searches.
12 years developing raster graphics and image processing systems, I/O controllers and multiprocessor workstations. Invented and led development of the world’s first RAM-based color raster graphics system.
10 years applied symmetric multiprocessing to LAN servers and pioneered the use of a LAN as a virtual I/O channel. Invented and led development of the world’s first LAN with dynamically variable data rates.
15 years wireless data networks.
3 years writing operating systems and compilers

Core Expertise:
Patent infringement analysis•Patent review•Claim charts•Hardware & software reverse engineering•Telecommunications standards•Optical components•Optical systems & networks•RF & analog circuits•System on chip•Bluetooth, Wi-Fi & LTE•Claim language•People & project management
Accomplishments:
7+ patents and 4+ presentations
Previous Companies:
Simplified Optics•Chipworks•Solantro
Summary:

Strategic patentanalyst specializingin telecommunicationstandards, opticalcomponents,systemsandnetworks, analogcircuits,andsystemsonchipwith25yearsofexperience including3yearsanalyzingpatentsanddocumenting patentinfringement inclaimcharts.•Innovativepatentanalystwith13issuedpatentshavingdevelopedtwonew methodologiestofindevidenceofuseforsystempatents.•AbilitytoreverseengineerRF,analog,anddigitalcircuits,andCsoftwaresourcecode.•Autonomousindividualwithmanagerialskillsincludingprojectandpeoplemanagement,businessacumen,andlegallanguageunderstanding.

Core Expertise:
• Semiconductor Process and Materials Research/Development • Encompassing Interconnect Conductive multi-level metallization, gate metallization, Inter-level dielectric Isolation and Passivation for fabrication of DRAM • Flash EEPROM • EPROM • Bipolar • Microprocessors • Semiconductor Microchip Packaging Materials and Process • Material’s Electrical, Mechanical, Chemical Characterization, and Product Reliability
Accomplishments:
• 4 patents total, 3 in the area of Interconnect Technology
• 8 Publications
Previous Companies:
• Wilinx • Intel • Advanced Micro Devices (AMD) • United Technologies
Summary:

Over 25 years of experience in the semiconductor industry as an Individual Technical Contributor, Senior Technologist, Senior Technical Manager and Technical Fellow.

Category:
Core Expertise:
• DFT • ATPG • Boundary Scan • Product Engineering
Accomplishments:
• 3 Publications
• 2 Patents Awarded
Previous Companies:
• Qualcomm • Renesas • Texas Instruments • Synopsys • LSI Logic • Intel
Summary:

Over 14 years of hands-on customer-facing ASIC engineering and industry experience.
Specialization in MicroElectronics

Core Expertise:
•Circuitdesign•FPGA design•DFT•Reconfigurable logic & tools
Accomplishments:
6+ patents issued, Co-author on 26+patents, 13 articles/conference papers (SuperCon ’96 Outstanding Paper award)
Previous Companies:
•Element CXI•Droplet Technology•Morphics Technologies
Summary:

•More than 20 years digital design, analysis, and implantation(focus on reconfigurable logic & tools)•Analyst/engineeron reconfigurable Dataflow μP,DFEIP•Co-engineer of a 12M-gateASIC (0.18μ, 240MHz)•350+ FPGA designs (Xilinx, Altera)•Multiple DFT projectsoScan controller with {1:n}-step, breakpoint, etc.oEmbedded mux-selectable module-under-testscheme•Highly skilled at analyzing and resolving complex problems in logic design, simulation, verification, timing closure, and test; specializing inCircuit and FPGA designs with emphasis on rigorous methodologies delivering maintainable, modifiable, and repeatable high-performance results; twisting tools (improvising)

Core Expertise:
Microprocessors, Optical and magnetic storage, Technology licensing, ELC gate arrays
Accomplishments:
BSEE, 25+ years of experience, 3 patents, Board and finance committee of an educational non-profit, CEO of a mobile security devices supplier company, President of a non-profit technology
Previous Companies:
Transmeta, Cirrus Logic, Sun Microsystems, Digital Equipment
Core Expertise:
• Cellular technologies: LTE, LTE-A, Carrier Aggregation-CA, HSPA, HSPA+, Multi-SIM, Wi-Fi, WLAN • Requirement analysis, test planning and test case development • Strong cellular modem System/HW/FW Protocol and call flow debugging and analysis skillset • GCT/PTCRB/Carrier certification • Mobile handset and base station testing • Lab/Field testing and log analysis • Mobile handset/base station testing • Working knowledge on test equipment • Automation Frame work development tool SW-Anritsu, Rohde & Schwarz, Anite, Agilent, Spirent
Accomplishments:
20 years of experience in wireless technologies
Previous Companies:
• Hughes Network Systems • Qualcomm • Texas Instruments • Nokia • Novatel Wireless • Ericsson
Summary:

20 years of experience in third/fourth/fifth generation wireless technologies, system integration, Wi-Fi, RF engineering in regard to LTE, WCDMA, HSPA+, network communication, life cycle development, and system design

Core Expertise:
•Operational systems (ERP…)•Quality systems (ISO 9001)•Photo (resist apply, image, bake, develop) –including lift-off•Wet Etching / Dry Etching (RIE, plasma)•Metal deposition (sputtering, organometallic, PECVD, etc)•Plating (electroless, electrolytic)•CNC, EDM, laser ablation / milling•Stamping, extruding, coining•Injection molding (plastic and metal), transfer molding (plastics)•Sintering, soldering, brazing, diffusion bonding•Expert in ICpackaging•Surface Mount Technology•Antenna design and development•Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
Accomplishments:
38 patents issued in the area of electronics, 24 papers presented at electronics conferences, 7 articles in industry magazines and Session chair at multiple conferences
Previous Companies:
•Intel•Sprint•Wireless Facilities Inc.
Core Expertise:
Data converters, Mixed and analog signals
Accomplishments:
MSEE, 30+ yrs of experience
Previous Companies:
ST, Motorola, Bell Labs
Core Expertise:
FinFET, Low power Hardware/Software designs, IC & Systems design, Computer security, Quantum computing
Accomplishments:
Professor, 35+ yrs experience, 49 research grants, 18 patents, 445 conference/lecture/papers/publication
Previous Companies:
University of Michigan, Princeton University
Core Expertise:
Computer power solutions•Power converter design•Analog/digital circuit design•Simulation and modeling•LED lighting•Power ICs
Accomplishments:
•60+ patents
•35+ of experience
•IEEE Senior Member
Previous Companies:
Cree•Intersil Corporation•International Rectifier Corp
Summary:

•Created computer power solutions.•Reduced the electronics cost by over 15%.•Lead the development of a PFC boost.•Lead control IC for LED bulb applications.•Initiated and drove the development of multi-phase IC products.•Industry’s leading computer power solutions.•Ramped to 2M units per month rate in less than 4 months.•Architected Intersil’s portable computer CPU power IC family.•Defined Intersil’s multiphase power management IC family that sold over 1.2B units in the 5 years.•Created a unique LED lighting.

Accomplishments:
Inventor and co-inventor, 16 US patents.•Recipient, 5 STMicroelectronics Exceptional Patent Awards.•Member, STMicroelectronics’US Patent Committee.•Several papers published at technical conferences.•Editor of ST Journal of System Research.
Previous Companies:
STMicroelectronics
Summary:

•Experienced semiconductor professional, helping companies bring their ASIC to market, from specification and architecture to procurement and qualification. Also consulting as an independent expert in IP litigation or technical due diligence.

Core Expertise:
•Expert in LCDs, TFTs, LEDs, OLEDs, LDs, CMOS IC/transistor device structure, and lasers.•Experienced in consumer electronics, semiconductor, automotive products, photonics, and display technologies.•Distinguished Inventor•Experienced patent analyst
Accomplishments:
•18 US patents
•6 Japan patents
•Senior Member of IEEE
•17 Research Grants
•30 Refereed Journal Publications
•5 Books and Book Chapters
•81 Technical Conference Publications and Presentations:
•12 Other publications
Previous Companies:
•Sony•IBM•Rambus•A prominent LED lighting manufacturer
Summary:

•25+ years of industry experience in lasers and displays as well as other consumer electronics.

Core Expertise:
• Fiber Optic Telecommunication Networks • FTTH/PON/HFC • CWDM/DWDM • BC/NC Video Overlay • Ethernet Over Fiber • TV Transmission over Fiber • RF/Microwave/Millimeter-Wave
Accomplishments:
• 13 granted patents
• Senior Member of IEEE
Previous Companies:
• Huawei/Futurewei • Motorola
Summary:

Specialized in optical networks and components
Developed system models and hardware
R&D in fiber optics and photonics.
Expert witness experience
Performance analysis of satellite cross-link.
Optical distribution of microwave signals in satellites.

Core Expertise:
Power Management Integrated Circuit (PMIC) design: DC/DC Converters Buck, Boost, Fly-Back, LDO, Charge pump, Bootstrap Capacitor Switching regulator to generate reverse polarity or higher and/or lower voltages. • Analog Circuits designs: Class A, AB, and C amplifiers, voltage follower (Common Collector, Common Drain), Common Gate or Common Base, Common Emitter or Common Source, Telescopic Cascode, Folded Cascode, current mirrors, high dynamic range low voltage cascode current mirrors, differential pairs, Op Amps, PTAT, Band Gap, comparators with hysteresis, LDO, and Feedback systems. • RF Mixers (Gilbert Cells), LNA, VCO, RSSI, high speed logic (ECL & SCL) for prescaler , and oscillator designs. • Monolithic Microwave Integrated Circuit (MMIC) circuit design in BiCMOS & CMOS using Si, SiGe, and GaAs Technology. • Phase Locked Loop (PLL) circuits (Phase Frequency Detector (PFD), PLL Loop Filter, Charge Pump, VCO, Prescaler, and divide by N) and PLL system design (P, P+1) • Chip System level ESD protection to meet HBM, CDM, and MM standards, ESD device protection circuit for input, outputs, drivers, and RF circuits. • Probing de-capped and de-pacified ICs to debug chip’s circuits
Previous Companies:
Qualcomm • Agere Systems, Inc. • Cadence Design Systems, Inc.
Summary:

• Designing Power Management Integrated Circuits (PMIC) or Analog Integrated Circuits

Core Expertise:
•High performance analog mixed signal•RF IC design & layout•Discrete-component board level design and layout•System analysis
Accomplishments:
•IEEE Senior Member.
•Two-time Hughes Aircraft Division Patent Award winner.
•59 issued US patents, over 200 issued international patents.
•Numerous IC design team awards at Hughes and Raytheon.
•Hughes Masters Fellow, Engineers Fellow, Doctoral Fellow.
•Menara Networks EDC IC Team Award.
Previous Companies:
•Menara Networks•Hughes Aircraft / Raytheon
Summary:

20+ years of experience especially in high performance / high dynamic range analog mixed signal, custom digital, and RF integrated circuit design.