Circuits

Antenna, Power Amplifier design, RF circuit design, mobile base stations physical layer
University Professor, 16+ patents, 9 invited presentations, 51 journal/conference papers, 2 book chapters
Nokia, Powerwave

Over 35 years of hands-on experience in radio frequency engineering.Expertise in: High power amplifiers, transceiver and antenna design, communication and radar subsystem design.
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• Research and development of UWB, UMTS (WCDMA, HSDPA), and GSM systems. • Expertise in low power systems design for high speed modems and multi-media applications • Development of advanced UWB and UMTS transceivers, low power consumption architecture, and cross layer algorithm design
• 6 US Patents
• 6 Publications
• Broadcom • Qualcomm

Nearly 20 years of experience in the wireless communication systems field in both start-up and large companies in research and development.

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• Telecommunication Systems & Cellular Modem development • 3GPP UMTS and LTE Standard • ASIC/FPGA Design, Implementation & Verification • Embedded and DSP Software Development
• 8 US patents and 35+ European and International patents awarded
• 20 technical papers and publications
• 2 books published
• Adjunct Professor and Lecturer of courses in 2G, 3G, and 4G Telecommunication Systems (LTE)
• Review Panel Member for the National Science Foundation (NSF)
• Samsung • Siemens

Highly dedicated, passionate and successful telecommunications and DSP System-on-Chip (SoC) Architect, ASIC Designer and Embedded Software design leader offering more than 20 years of technology experience with 15+ years of industry experience designing and managing telecommunications, electronic design automation and image processing products and projects.

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Analog and RF circuit designs, Power management integrated circuit (PMIC), DC/DC Converters, LDO, amplifiers, LNA, RF mixers, PLL, ESD, charge pumps, rectifiers
PhD, 17 yrs of experience, 30+ commercial analog & PMIC designs, 11+ RFIC designs, 6+ discrete RF designs, multiple peer-reviewed papers
Qualcomm, Agere, Cadence
Flash memory, EPROM, Cryptography, ASIC, serial ATA, PCI, Cyber security, 802.11ab/g (wireless LAN), 802.3ae(10G Ethernet), Semiconductor failure analysis/Production/Manufacturing
MSEE, 20 yrs of experience, Forensic investigator, lecturer
Intel, AMD, Philips
wireless systems design, development, standards, mobile stations, base stations, 802.11xx, GSM, WCDMA, CDMA2000, LTE, LTE-Advanced, LTE-U, MIMO, Transmit diversity, MIMO, VoLTE
PhD, 23 yrs of hands-on experience, 70+ patent applications, numerous publications and book authorship
Qualcomm, Powerwave, Fujitsu, Motorola, Texas Instruments
Set-Top Box, MPEG-2, IEEE1394, Ethernet, DOCSIS, ARM, I2C, VHDL, HDLC, Video/Audio drivers, embedded Linux, Multi Thread RTOS environments, PCI
MSEE, 20+ yrs of experience, 6 patents
Vivato, Elintrix, Solekai Systems, Wind Rivers System, Rainbow Networks, Conexant Systems, Comstream Corporation
Embedded DRAM Memory, Semiconductor, Patent infringment, Failure analysis, transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital)
BSEE, 35+ yrs of experience
Texas Instruments, Chipworks, Mosaid Technologies, Apollo Systems Research Corp, Taeus, Atmos, Nortel, STMicroelectronics, Omicron
• Processors/CPUs, PCB, Fab processes • Ultra Fast Mixed-Signal Circuit, Space-based Communications, advanced submicron devices • Extensive experience with wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth • Hands on CMOS: architecture, design, tape-out and test complex chips, including memory, mixed signal, and RF • Extensive chip reverse engineering experience • Extensive circuit extraction experience • Patent and IP / IPR experience
• 100+ patents
• 30+ mixed signal chips designed/fabricated
• 70 technical publications
• Professional Engineer (PE)
• Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute
• Intel • Altera

Over 20 years of experience in the semiconductor manufacturing industry.
PhD in EE, minor in Aeronautical Engineering, Space-based Communications
Over a decade of experience at Intel

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Bio-sciences, Drug Design/Discovery, small molecule research
Post-Doc Bio-Chemistry, 23 yrs of experience, Chief scientific officer
Amgen, Epigen Combichem, DuPont, Optimer
Advanced IC packaging; Materials characterization; Memory packaging in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F; Strong materials background (corrosion, organic/inorganic hybrid coating, adhesion, solder metallurgy, electroplating)
MS in Material Science, 32 patents, 13 yrs of experience, CEF certification
Micron, Moen, Ralson
DRAM/Flash IC, IC/CAD, pre and post-silicon, IT cloud technology
PhD, 30+ Yrs of experience, Co-Awarded “The Innovator of the Year”, Instructor of Associate & Bachelor Degree Programs
Siemens, Netlist, Ramaxel Technologies, Qimonda/Infineon
RF System design including high level architecture and behavioral modeling, Detailed system lineup and high level link budget, External component specifications and embedding, RF circuits design with simulation modeling, as well as hands on lab validation and optimization, RF/Mixed Signal block and modem partitioning
• AeA High Tech Innovation Awards
• EE Times ACE Awards
• Member of IEEE Solid State Circuits
NXP, Rockwell Semi, Ericsson, Radio System

Passionate senior communication systems semiconductor business leader with extensive expertise. Specializes in business center management, RF systems, RFIC, mixed signal and DSP R&D management.
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• Automotive Systems • wireless data networks, high-speed LANs, multithreaded processors, intelligent I/O controllers, object-oriented systems, I/O and OS virtualization, and raster graphics. • instruction set architecture, system busses, cache and associative memories, symmetric multiprocessors, event driven systems, object-oriented systems, I/O protocols and interfaces, and the history of computing. • IEEE 802.11 standard and Wi-Fi products that implement 802.11 • low-power circuit techniques, including both dynamic logic and asynchronous logic.
• 40 + patents
• IEEE 802 LAN/MAN Standards Committee
• Voting member, 1993-2002; Editor, State Machines, 1996-1999; Editor, Task Group E, 2000-2002
• JEDEC JC-61 Standards Committee, Member
• Designed 24 processors in technologies ranging from TTL MSI to 45nm CMOS.
Freescale, Intersil, Conexant

Over 30 years of experience in computer and system architecture, R&D, wired and wireless data networks, LTE, Wi-Fi protocols and IEEE 802.11 standards.
More than 25 patent litigation cases. Gave depositions and testified in court both in the U.S. and in Europe. Did numerous portfolio evaluations, claim analyses and prior art searches.
12 years developing raster graphics and image processing systems, I/O controllers and multiprocessor workstations. Invented and led development of the world’s first RAM-based color raster graphics system.
10 years applied symmetric multiprocessing to LAN servers and pioneered the use of a LAN as a virtual I/O channel. Invented and led development of the world’s first LAN with dynamically variable data rates.
15 years wireless data networks.
3 years writing operating systems and compilers

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Optical networks, Optical trasnceivers, DWDM
MSEE, over 20 yrs experience in optical product development and related standards
Xtera, Solantro, Meriton Networks, AcceLight Networks, Nortel
• Semiconductor Process and Materials Research/Development • Encompassing Interconnect Conductive multi-level metallization, gate metallization, Inter-level dielectric Isolation and Passivation for fabrication of DRAM • Flash EEPROM • EPROM • Bipolar • Microprocessors • Semiconductor Microchip Packaging Materials and Process • Material’s Electrical, Mechanical, Chemical Characterization, and Product Reliability
• 4 patents total, 3 in the area of Interconnect Technology
• 8 Publications
• Wilinx • Intel • Advanced Micro Devices (AMD) • United Technologies

Over 25 years of experience in the semiconductor industry as an Individual Technical Contributor, Senior Technologist, Senior Technical Manager and Technical Fellow.

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• DFT • ATPG • Boundary Scan • Product Engineering
• 3 Publications
• 2 Patents Awarded
• Qualcomm • Renesas • Texas Instruments • Synopsys • LSI Logic • Intel

Over 14 years of hands-on customer-facing ASIC engineering and industry experience.
Specialization in MicroElectronics

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Reconfigurable Dataflow µP, DFE IP, 12M-gate ASIC, FPGA (Xilinx, Altera), DFT
BS, 20+ years of experience,6 patents, co-authored 26 patents, 13 articles/conference papers
Element CXI, Droplet Technology, Morphics Technologies, HighGate Design
Microprocessors, Optical and magnetic storage, Technology licensing, ELC gate arrays
BSEE, 25+ years of experience, 3 patents, Board and finance committee of an educational non-profit, CEO of a mobile security devices supplier company, President of a non-profit technology
Transmeta, Cirrus Logic, Sun Microsystems, Digital Equipment
DSL Satellite, Semiconductor, Video Compression, Video Streaming, VoIP, Embedded Software, Internet Software
Ph.D, 20+ Yrs of experience, 2 Patents, 8 Publication
Maxim Integrated Products, Texas Instrument, 8*8, Hughes Aircraft
• Cellular technologies: LTE, LTE-A, Carrier Aggregation-CA, HSPA, HSPA+, Multi-SIM, Wi-Fi, WLAN • Requirement analysis, test planning and test case development • Strong cellular modem System/HW/FW Protocol and call flow debugging and analysis skillset • GCT/PTCRB/Carrier certification • Mobile handset and base station testing • Lab/Field testing and log analysis • Mobile handset/base station testing • Working knowledge on test equipment • Automation Frame work development tool SW-Anritsu, Rohde & Schwarz, Anite, Agilent, Spirent
20 years of experience in wireless technologies
• Hughes Network Systems • Qualcomm • Texas Instruments • Nokia • Novatel Wireless • Ericsson

20 years of experience in third/fourth/fifth generation wireless technologies, system integration, Wi-Fi, RF engineering in regard to LTE, WCDMA, HSPA+, network communication, life cycle development, and system design

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Fab process & materials (wafer, PCB, assembly, components, IC packaging): Photo, Etching (Wet, Dry), Metal deposition, Plating, CNC, EDM, laser ablation/milling, Stamping, extruding, coining, Injection molding, transfer molding, Sintering, soldering, brazing, diffusion bonding, Surface mount technology; Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
MS, 30+ yrs of experience, 38 patents, 24 papers
Ethertronics, IBM, Amkor, CoolClouds
Data converters, Mixed and analog signals
MSEE, 30+ yrs of experience
ST, Motorola, Bell Labs
FinFET, Low power Hardware/Software designs, IC & Systems design, Computer security, Quantum computing
Professor, 35+ yrs experience, 49 research grants, 18 patents, 445 conference/lecture/papers/publication
University of Michigan, Princeton University
Power converter, Analog/Digital circuit, PFC boost, LED, IC
MS, 35+ years of experience, Created unique LED lighting, IEEE senior member, 60+ patents filed
GE – Aerospace Control Sys., Harris Semiconductor, Intersil, Cree, International Rectifier Corporation
RF DSP, STM32 microcontrollers, MEMS, DC-DC converters, Imaging sensors, MPEG audio/video decoders
MS, 25 years of experience, Received 5 STMicrolelctronics Exceptional Patent Awards, 16 US patents, Several papers published
STMicroelectronics
Consumer electronics, Semiconductor, Automotive products, Photonics, Display, LCDs, TFTs, LEDs, OLEDs, LDs, CMOS IC/transistor device structure, and lasers
25+ yrs of industry experience in lasers and displays as well as other consumer electronics.
Sony, IBM, Rambus, A prominent LED lighting manufacturer
• Fiber Optic Telecommunication Networks • FTTH/PON/HFC • CWDM/DWDM • BC/NC Video Overlay • Ethernet Over Fiber • TV Transmission over Fiber • RF/Microwave/Millimeter-Wave
• 13 granted patents
• Senior Member of IEEE
• Huawei/Futurewei • Motorola

Specialized in optical networks and components
Developed system models and hardware
R&D in fiber optics and photonics.
Expert witness experience
Performance analysis of satellite cross-link.
Optical distribution of microwave signals in satellites.

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• High performance analog mixed signal • RF IC design & layout • Discrete-component board level design and layout • System analysis
• IEEE Senior Member
• Two-time Hughes Aircraft Division Patent Award winner
• 59 issued US patents, over 200 issued international patents
• Numerous IC design team awards at Hughes and Raytheon
• Hughes Masters Fellow, Engineers Fellow, Doctoral Fellow
• Menara Networks EDC IC Team Award
• Menara Networks • Hughes Aircraft / Raytheon

20+ yrs of experience especially in high performance / high dynamic range analog mixed signal, custom digital, and RF integrated circuit design
59 granted US patents
200+ international patents