T351

Core Expertise: Fab process & materials (wafer, PCB, assembly, components, IC packaging): Photo, Etching (Wet, Dry), Metal deposition, Plating, CNC, EDM, laser ablation/milling, Stamping, extruding, coining, Injection molding, transfer molding, Sintering, soldering, brazing, diffusion bonding, Surface mount technology; Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
Accomplishments: MS, 30+ yrs of experience, 38 patents, 24 papers
Previous Companies: Ethertronics, IBM, Amkor, CoolClouds