T286

Core Expertise:
• Semiconductor Process and Materials Research/Development • Encompassing Interconnect Conductive multi-level metallization, gate metallization, Inter-level dielectric Isolation and Passivation for fabrication of DRAM • Flash EEPROM • EPROM • Bipolar • Microprocessors • Semiconductor Microchip Packaging Materials and Process • Material’s Electrical, Mechanical, Chemical Characterization, and Product Reliability
Previous Companies:
• Wilinx • Intel • Advanced Micro Devices (AMD) • United Technologies