T286

Core Expertise: • Semiconductor Process and Materials Research/Development • Encompassing Interconnect Conductive multi-level metallization, gate metallization, Inter-level dielectric Isolation and Passivation for fabrication of DRAM • Flash EEPROM • EPROM • Bipolar • Microprocessors • Semiconductor Microchip Packaging Materials and Process • Material’s Electrical, Mechanical, Chemical Characterization, and Product Reliability
Accomplishments: • 4 patents total, 3 in the area of Interconnect Technology
• 8 Publications
Previous Companies: • Wilinx • Intel • Advanced Micro Devices (AMD) • United Technologies
Summary:

Over 25 years of experience in the semiconductor industry as an Individual Technical Contributor, Senior Technologist, Senior Technical Manager and Technical Fellow.

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