T187
• 12+ yrs. diverse experience in advanced IC packaging development, process integration, materials characterization and program management • Authored 32 (issued/pending) patents and 16 technical publications • Certified Electroplater Finisher (CEF) by American Electroplaters and Surface Finishers Society • Knowledge of various characterization/FA techniques & problem solving methodologies 8D, DOE, SPC, FMEA, KT • Well versed in computer applications, highly motivated team leader with strong presentation and interpersonal skills