T187

Core Expertise:
Lead and developed several memory packaging technologies in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F, imagers and LEDs from conception to qualification & HVM • Strong materials background with keen interest in corrosion, organic-inorganic hybrid coatings, adhesion, solder metallurgy, electroplating, chip package interaction and semiconductor processing
Previous Companies:
Micron • Moen • Xilinx