T187

Core Expertise: Advanced IC packaging; Materials characterization; Memory packaging in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F; Strong materials background (corrosion, organic/inorganic hybrid coating, adhesion, solder metallurgy, electroplating)
Accomplishments: MS in Material Science, 32 patents, 13 yrs of experience, CEF certification
Previous Companies: Micron, Moen, Ralson