Teardown the LED devices and determine their construct
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Packet sniffing on communication between the devices and various smartphones
Qualitatively show the flexibility of the chips.
Quantitatively measure stress within the chips
Determine/Estimate the architecture of the active antenna array technology used in the product.
Determine if the Power Amplifier Module (PAM) uses Doherty combiner architecture and simulate its performance under dynamic loads
Determine if a certain type of circuit blocks is present in the product.
Analyze the interface between the copper layers and the insulator layers in the package PCB.
Determine if the products use certain optional features of the H.264 video codec standard.
Confirm the smartphone include an organic DASH client
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