Flash memory, EPROM, Cryptography, ASIC, serial ATA, PCI, Cyber security, 802.11ab/g (wireless LAN), 802.3ae(10G Ethernet), Semiconductor failure analysis/Production/Manufacturing
MSEE, 20 yrs of experience, Forensic investigator, lecturer
Intel, AMD, Philips
Embedded DRAM Memory, Semiconductor, Patent infringment, Failure analysis, transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital)
BSEE, 35+ yrs of experience
Texas Instruments, Chipworks, Mosaid Technologies, Apollo Systems Research Corp, Taeus, Atmos, Nortel, STMicroelectronics, Omicron

PhD in EE; minor in Aeronautical Engineering; Space-based Communication; over 20 years of experience in the semiconductor manufacturing industry

Processors/CPUs, PCB, Fab processes; wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth; CMOS design, architecture, tape-out and test including memory, mixed signal, and RF; chip reverse engineering; circuit extraction; patent analysis
30+ mixed signal chips designed/fabricated; 70 technical publications; 100+ patents; Professional Engineer; Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute

Intel, Airfy Communications, Altera
Advanced IC packaging; Materials characterization; Memory packaging in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F; Strong materials background (corrosion, organic/inorganic hybrid coating, adhesion, solder metallurgy, electroplating)
MS in Material Science, 32 patents, 13 yrs of experience, CEF certification
Micron, Moen, Ralson
DRAM/Flash IC, IC/CAD, pre and post-silicon, IT cloud technology
PhD, 30+ Yrs of experience, Co-Awarded “The Innovator of the Year”, Instructor of Associate & Bachelor Degree Programs
Siemens, Netlist, Ramaxel Technologies, Qimonda/Infineon