Hardware

Power Amplifier design, RF circuit design, mobile base stations physical layer
University Professor, 30+ years of experience, 16+ patents, 9 invited presentations, 51 journal/conference papers, 2 book chapters
Nokia, Powerwave
mobile modem architecture, power management & optimization, Dynamic Voltage & Current Scaling, WCDMA, LTE, UWB
PhD, 12+ yrs of experience, 10+ patents, 10+ journal/conference papers, multitudes of awards
Qualcomm, Broadcom, Xerox
Mobile Systems 3G & 4G, ASIC & FPGA Design
PhD, 15 yrs of experience, 22 papers, 2 books, 35+ patents, University of California lecturer
Samsung, Siemens
Analog and RF circuit designs, Power management integrated circuit (PMIC), DC/DC Converters, LDO, amplifiers, LNA, RF mixers, PLL, ESD, charge pumps, rectifiers
PhD, 17 yrs of experience, 30+ commercial analog & PMIC designs, 11+ RFIC designs, 6+ discrete RF designs, multiple peer-reviewed papers
Qualcomm, Agere, Cadence
Flash memory, EPROM, Cryptography, ASIC, serial ATA, PCI, Cyber security, 802.11ab/g (wireless LAN), 802.3ae(10G Ethernet), Semiconductor failure analysis/Production/Manufacturing
MSEE, 20 yrs of experience, Forensic investigator, lecturer
Intel, AMD, Philips
wireless systems design, development, standards, mobile stations, base stations, 802.11xx, GSM, WCDMA, CDMA2000, LTE, LTE-Advanced, LTE-U, MIMO, Transmit diversity, MIMO, VoLTE
PhD, 23 yrs of hands-on experience, 70+ patent applications, numerous publications and book authorship
Qualcomm, Powerwave, Fujitsu, Motorola, Texas Instruments
Set-Top Box, MPEG-2, IEEE1394, Ethernet, DOCSIS, ARM, I2C, VHDL, HDLC, Video/Audio drivers, embedded Linux, Multi Thread RTOS environments, PCI
MSEE, 20+ yrs of experience, 6 patents
Vivato, Elintrix, Solekai Systems, Wind Rivers System, Rainbow Networks, Conexant Systems, Comstream Corporation
Embedded DRAM Memory, Semiconductor, Patent infringment, Failure analysis, transistor-level circuit extraction & analysis of memories and mixed-signal (analog/digital)
BSEE, 35+ yrs of experience
Texas Instruments, Chipworks, Mosaid Technologies, Apollo Systems Research Corp, Taeus, Atmos, Nortel, STMicroelectronics, Omicron

PhD in EE; minor in Aeronautical Engineering; Space-based Communication; over 20 years of experience in the semiconductor manufacturing industry


Processors/CPUs, PCB, Fab processes; wireless protocols including 802.11, GSM/GPRS/EDGE, Bluetooth; CMOS design, architecture, tape-out and test including memory, mixed signal, and RF; chip reverse engineering; circuit extraction; patent analysis
30+ mixed signal chips designed/fabricated; 70 technical publications; 100+ patents; Professional Engineer; Senior member of IEEE, ARRL, NSPE, AAAS, SPIE, MRS, Naval Institute

Intel, Airfy Communications, Altera
Bio-sciences, Drug Design/Discovery, small molecule research
Post-Doc Bio-Chemistry, 23 yrs of experience, Chief scientific officer
Amgen, Epigen Combichem, DuPont, Optimer
Advanced IC packaging; Materials characterization; Memory packaging in TSV/3DI, WLP, flip chip, CPB, RDL, BOC, COB, F2F; Strong materials background (corrosion, organic/inorganic hybrid coating, adhesion, solder metallurgy, electroplating)
MS in Material Science, 32 patents, 13 yrs of experience, CEF certification
Micron, Moen, Ralson
DRAM/Flash IC, IC/CAD, pre and post-silicon, IT cloud technology
PhD, 30+ Yrs of experience, Co-Awarded “The Innovator of the Year”, Instructor of Associate & Bachelor Degree Programs
Siemens, Netlist, Ramaxel Technologies, Qimonda/Infineon
RF design, RFIC, Analog circuits, Antennas, Set-top box design and development
MSEE, 15 patents, 20 yrs of experience
NXP, Rockwell Semi, Ericsson
microprocessor design, low-power circuits, WLAN protocols and controllers, wired and wireless data networks, I/O controllers, LTE UE
40 yrs experience, largest contributions to IEEE802.11, designed 24 microprocessors, expert witness for 25 patent litigation cases, 33 granted patents
Freescale, Intersil, Conexant
Optical networks, Optical trasnceivers, DWDM
MSEE, over 20 yrs experience in optical product development and related standards
Xtera, Solantro, Meriton Networks, AcceLight Networks, Nortel
Semiconductor fabs, metallurgical Eng., Memory, Micro processors
PhD, AMD fellow, 30 yrs of experience, 4 patents, 8 papers
AMD, Intel, SGS Thompson
Reconfigurable Dataflow µP, DFE IP, 12M-gate ASIC, FPGA (Xilinx, Altera), DFT
BS, 20+ years of experience,6 patents, co-authored 26 patents, 13 articles/conference papers
Element CXI, Droplet Technology, Morphics Technologies, HighGate Design
Microprocessors, Optical and magnetic storage, Technology licensing, ELC gate arrays
BSEE, 25+ years of experience, 3 patents, Board and finance committee of an educational non-profit, CEO of a mobile security devices supplier company, President of a non-profit technology
Transmeta, Cirrus Logic, Sun Microsystems, Digital Equipment
DSL Satellite, Semiconductor, Video Compression, Video Streaming, VoIP, Embedded Software, Internet Software
Ph.D, 20+ Yrs of experience, 2 Patents, 8 Publication
Maxim Integrated Products, Texas Instrument, 8*8, Hughes Aircraft
Cellular technologies : LTE, LTE-A, Carrier Aggregation-CA, HSPA, HSPA+, Multi-SIM, Wi-Fi, WLAN, Strong cellular modem System/HW/FW Protocol and call flow debugging and analysis skillset, GCT/PTCRB/Carrier certification, Mobile handset and base station testing, Test department budget management, Lab/Field testing and log analysis, Mobile handset/base station testing, Requirement analysis, test planning and test case development, Automation Frame work development tool SW-Anritsu, Rhode & Schwartz, Anite, Agilent, Spirent
20+ yrs of experience in 3G/4G/5G, system integration, Wi-Fi, LTE, WCDMA, HSPA+, network communication, life cycle development, and system design
Qualcomm, Texas Instruments, Nokia, Ericsson
Fab process & materials (wafer, PCB, assembly, components, IC packaging): Photo, Etching (Wet, Dry), Metal deposition, Plating, CNC, EDM, laser ablation/milling, Stamping, extruding, coining, Injection molding, transfer molding, Sintering, soldering, brazing, diffusion bonding, Surface mount technology; Thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers, etc)
MS, 30+ yrs of experience, 38 patents, 24 papers
Ethertronics, IBM, Amkor, CoolClouds
Data converters, Mixed and analog signals
MSEE, 30+ yrs of experience
ST, Motorola, Bell Labs
FinFET, Low power Hardware/Software designs, IC & Systems design, Computer security, Quantum computing
Professor, 35+ yrs experience, 49 research grants, 18 patents, 445 conference/lecture/papers/publication
University of Michigan, Princeton University
Power converter, Analog/Digital circuit, PFC boost, LED, IC
MS, 35+ years of experience, Created unique LED lighting, IEEE senior member, 60+ patents filed
GE – Aerospace Control Sys., Harris Semiconductor, Intersil, Cree, International Rectifier Corporation
RF DSP, STM32 microcontrollers, MEMS, DC-DC converters, Imaging sensors, MPEG audio/video decoders
MS, 25 years of experience, Received 5 STMicrolelctronics Exceptional Patent Awards, 16 US patents, Several papers published
STMicroelectronics
Consumer electronics, Semiconductor, Automotive products, Photonics, Display, LCDs, TFTs, LEDs, OLEDs, LDs, CMOS IC/transistor device structure, and lasers
25+ yrs of industry experience in lasers and displays as well as other consumer electronics.
Sony, IBM, Rambus, A prominent LED lighting manufacturer
Fiber Optic Telecommunication Networks, FTTH/PON/HFC, CWDM/DWDM, BC/NC Video Overlay, Ethernet Over Fiber, TV Transmission over Fiber, RF/Microwave/Millimeter-Wave
13 granted patents, Senior Member of IEEE
Huawei/Futurewei, Motorola, An aerospace, defense and security company, A research center for aircrafts